High Temperature Heat Resistant Tape 250-300°F - High Insulation Adhesive Tape for 3D Printers, No Residue - 20mm Wide - Perfect for Electronics, HVAC, and Industrial Applications
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Description
This fits your . Make sure this fits by entering your model number. 300 high temperature resistant in the short run, 250 high temperature resistant for a long time. High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. High insulation ensures the safety. Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.
Features
300 high temperature resistant in the short run, 250 high temperature resistant for a long time.
High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time.
High insulation ensures the safety.
Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling.
33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.
